Heat dissipation is a critical factor governing the performance, lifespan, and consistency of electronic devices. The emergence of new applications such as light emitting diodes (LED) and functionalization of electronics made the thermal dissipation a challenging issue. Aluminium alloys are generally used to control the higher heat fluxes in electronics. According to the leading conductive plastic manufacturers, the higher thermal conductivity of metals cannot be effectively utilised if the conduction of heat to the surface of material is faster than the air-flow convection removing the heat from source. Thus the thermally conductive plastics are suitable in applications where convection is a limiting factor. Other driving factors to use thermally conductive WPC are light weight and ease of processing when compared to metals.

F-WPC can be utilised not only in the thermal management of electronics but also in the thermal management of buildings. This can be achieved by incorporating suitable materials that control the temperature in the F-WPC with improved thermal conductivity.

WPCs are primarily used as decking. Integration of F-WPC with continuous cellulose fibre will enable the production of electrically heated decking without sacrificing the structural properties. It is expected to be value-added property in decking materials and will stimulate wider use of WPC. Electrically functional WPC is also assumed to find its application as electromagnetic shielding and as electrostatic discharge material (ESD).

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